Sil-Pad K-10
The High Performance Kapton® Based Insulator
Sil-Pad 900S
High Performance Insulator for Low Pressure Applications
Gap Pad VO Ultra Soft
Additional Conformability, Thermal Conductivity for Filling Air Gaps
Hi-Flow 225U
Non-Reinforced Phase Change Thermal Interface Material
Thermal Interface Material for High Performance Computer Processors
Bond-Ply 100
Thermally Conductive, Pressure Sensitive Adhesive Tape
Heat Seal: Reliability
Bergquist’s exclusive HeatSeal fabrication process thermally bonds switch layers together with heat and pressure.
Touch Screen: Flexibility of Design
The unique flexibility of the Bergquist 5-Wire pattern has changed the rules for 5-Wire size offerings.
Sil-Pad Design Guide
Touch Screen Brochure
Comprehensive TClad Selector Guide
Power Cord Brochure
Membrane Switch Brochure
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