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thermal interface materials
Sil-Pad K-10
The High Performance Kapton®-Based Insulator for Thermal Management of Electronics.
Sil-Pad 900S

High Performance Insulator for Low-Pressure Applications 

Gap Pad VO Ultra Soft
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps
Gap Pad 3000S30
Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material
Hi-Flow 225U
Non-Reinforced Phase Change Thermal Interface Material
Bond-Ply 100 (5 mil)
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape
Heat Seal: Reliability
Bergquist’s exclusive HeatSeal fabrication process thermally bonds switch layers together with heat and pressure.

Touch Screen: Flexibility of Design
The unique flexibility of the Bergquist 5-Wire pattern has changed the rules for 5-Wire size offerings.

New Thermal Clad® White Paper Helps Create the Optimal Circuit Design

This new 8-page technical booklet is full of charts, photos and the right data that can guide you to the most optimally designed Thermal Clad circuit board. Base materials, part fabrication, non-standard array shapes, two-layer considerations and more are included in this valuable White Paper.

Click here to view or download the White Paper
 

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Bergquist and Osram
Partnership Announced


Bergquist is a certified partner of OSRAM's "LED Light for you" network. The network aims to provide a worldwide source of technical expertise in all aspects of LED lighting.
Click here to view Bergquist's LED page
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Introducing Online Technical Support!

Bergquist’s online technical support allows you to communicate live with one of our representatives. We’re available for online support Monday through Friday, 8am till 5pm, Central Standard Time.
How can we help you?

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Click here to ask your question online during Bergquist's business hours, 8am - 5pm Central Standard Time.