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December 01, 2007 - Gap Filler 1500 (Two-Part)
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The Bergquist Company announces the release of its latest liquid gap filling solution, Gap Filler 1500 (Two-Part). Gap Filler 1500 is a silicone based, two-component, room or elevated temperature cured product. As dispensed, this material is ultra-conforming and is ideal for filling unique and intricate air voids and gaps. As cured, Gap Filler 1500 is a soft, thermally conductive, form-in-place elastomer that is dry to the touch and will not pump-out from the interface. Gap Filler 1500 exhibits an excellent thermal performance (1.8W/m-K) and a high level of slump resistance. |
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April 06, 2007 - Sil-Pad 1200
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The Bergquist Company announces the release of its latest Sil-Pad product, Sil-Pad 1200. Sil-Pad 1200 is a fiberglass-reinforced thermal interface material, featuring an optional adhesive coating. The material's smooth and non-tacky surface allows for efficient repositioning and ease of use. Sil-Pad 1200 is supplied without a liner in dry form and on a carrier liner when supplied with optional adhesive coating. Exceptional thermal performance is exhibited at both low and high application pressures (thermal impedance is 0.53° C -in˛/W at 50 psi), making the product ideal for placement between electronic power devices and a heat sink in screw and clip mounted applications. |
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January 10, 2007 - Thermal Interface Materials and Cold Plates
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Bergquist assisted Lytron, manufacturer of cold plates, cooling systems, and heat exchangers, with an article on thermal interface materials for Lytron's customers. To be effective, all cold plates require intimate surface-to-surface contact with the component or board-to-be-cooled. Irregular surface areas, both on the electronic components and on the cold plate, prevent good contact. Hence, some type of thermally conductive interface material is necessary to fill the interstices between the mating surfaces. Click on http://www.lytron.com/support/thermal_interface.htm to learn more. | |
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January 07, 2007 - Gap Pad 2000SF
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The Bergquist Company welcomes the newest member to its Gap Pad family. Gap Pad 2000SF is a breakthrough silicone free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/m-K). While highly thermally conductive, the material stays exceptionally soft and more compliant than other silicone-free materials. Gap Pad 2000SF is capable of conforming to the most demanding contours while applying little or no stress on component leads. The unique rheology of Gap Pad 2000SF enables it to maintain its structural integrity throughout assembly and use. |
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July 25, 2006 - Gap Pad 5000S35
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Bergquist introduces the newest member of the S-Class gap filling product: Gap Pad 5000S35. Gap Pad 5000S35 is a fiberglass-reinforced gap filling material, featuring high thermal conductivity (5.0 W/m-K) for exceptionally low thermal resistance while maintaining low bulk hardness (35 Shore 00). This product's soft and compliant resin formulation is ideal for fragile components. | |
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July 18, 2006 - Sil-Pad 1100ST
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The Bergquist Company announces the rollout of its latest Soft Tack product, Sil-Pad 1100ST. Sil-Pad 1100ST features inherent tack on both sides and dual liners for easy placement and exceptional thermal performance (thermal impedance is 0.66ēC-in2/W at 50 psi). The material is fiberglass-reinforced and silicone-based, a thermal interface material designed specifically for high-volume auto-dispensing applications. | |
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February 06, 2006 - Bergquist Releases Gap Filler 3500S35
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The Bergquist Company announces the release of Gap Filler 3500S35, a technology-leading gap filling material that provides both exceptional thermal conductivity (3.6 W/m-K) and exceptional softness (Shore [00] - 32). No other product on the market features the same level of performance and conformability. | |
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