Who Is "Lucky Dog"?

Lucky is The Bergquist Company mascot. He's dependable, mature, stately, loyal and demonstrates a real "can-do" attitude.

Headlines at Bergquist

June 1, 2009 - Hi-Flow 330P

The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials, Hi-Flow 330P. Hi-Flow 330P has excellent handling characteristics. With a polyimide film reinforcement, its top side is dry to the touch and its bottom side has a natural tack. The polyimide reinforcement gives Hi-Flow 330P high dielectric strenght and cut-through resistance. Hi-flow 330P's thermal performance is exceptional with a thermal impedance of 0.17ºC-in²/W at 50 psi.

September 16, 2008 - Liqui-Bond SA 1800 (One Part)

The Bergquist Company is excited to announce the addition of another high performance product, Liqui-Bond SA 1800, to its liquid silicone adhesive family. Liqui-Bond SA 1800 features both a high thermal conductivity (1.8 W/m-K) and a low viscosity, allowing for ease of screen or stencil application. The material is also well suited for high volume automated dispensing. Liqui-Bond SA 1800 is a one-part material that cures and bonds at elevated temperatures and eliminates the need for mechanical fasteners, reducing labor, cost and complexity.

August 01, 2008 - Hi-Flow 565U and 565UT

The Bergquist Company introduces the latest in thermally conductive phase change materials, Hi-Flow 565U and Hi-Flow 565UT. Both materials perform like high-end thermal greases, yet can be applied in pad form, eliminating the mess and application headaches associated with grease. Hi-Flow 565U is dry to the touch and provided in tabulation form for easy placement. 565UT is naturally tacky and is also supplied in tabulation form. Hi-Flow 565U has a 52ºC phase change temperature. Hi-Flow 565UT has a phase change softening temperature of 52ºC to provide optimum wet out. These materials offer exceptional thermal performance (thermal impedance of 565U is 0.04ºC-in2/W at 25 psi and 565UT 0.05ºC-in²/W). Hi-Flows 565U and 565UT are unreinforced materials and are targeted for high performance applications compensating for varied surface finishes and flatness tolerances.

July 15, 2008 - Gap Pad 1500S30

The Bergquist Company announces the launch of its latest S-Class gap filling material - Gap Pad 1500S30. Gap Pad 1500S30 maintains a conformable, highly elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. This fiberglass-reinforced, silicone-based material is highly compliant and is ideal for decreasing strain on fragile component leads and solder balls.

December 01, 2007 - Gap Filler (Two-Part)

The Bergquist Company announces the release of its latest liquid gap filling solution, Gap Filler 1500 (Two-Part). Gap Filler 1500 is a silicone based, two-component, room or elevated temperature cured product. As dispensed, this material is ultra-conforming and is ideal for filling unique and intricate air voids and gaps. As cured, Gap Filler 1500 is a soft, thermally conductive, form-in-place elastomer that is dry to the touch and will not pump-out from the interface. Gap Filler 1500 exhibits an excellent thermal performance (1.8W/m-K) and a high level of slump resistance.

April 06, 2007 - Sil-Pad 1200

The Bergquist Company announces the release of its latest Sil-Pad product, Sil-Pad 1200. Sil-Pad 1200 is a fiberglass-reinforced thermal interface material, featuring an optional adhesive coating. The material's smooth and non-tacky surface allows for efficient repositioning and ease of use. Sil-Pad 1200 is supplied without a liner in dry form and on a carrier liner when supplied with optional adhesive coating. Exceptional thermal performance is exhibited at both low and high application pressures (thermal impedance is 0.53° C -in²/W at 50 psi), making the product ideal for placement between electronic power devices and a heat sink in screw and clip mounted applications.

January 10, 2007 - Thermal Interface Materials and Cold Plates

Bergquist assisted Lytron, manufacturer of cold plates, cooling systems, and heat exchangers, with an article on thermal interface materials for Lytron's customers. To be effective, all cold plates require intimate surface-to-surface contact with the component or board-to-be-cooled. Irregular surface areas, both on the electronic components and on the cold plate, prevent good contact. Hence, some type of thermally conductive interface material is necessary to fill the interstices between the mating surfaces.

Click on http://www.lytron.com/support/thermal_interface.htm to learn more.

January 07, 2007 - Gap Pad 2000SF

The Bergquist Company welcomes the newest member to its Gap Pad family. Gap Pad 2000SF is a breakthrough silicone free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/m-K). While highly thermally conductive, the material stays exceptionally soft and more compliant than other silicone-free materials. Gap Pad 2000SF is capable of conforming to the most demanding contours while applying little or no stress on component leads. The unique rheology of Gap Pad 2000SF enables it to maintain its structural integrity throughout assembly and use.

July 25, 2006 - Gap Pad 5000S35

Bergquist introduces the newest member of the S-Class gap filling product: Gap Pad 5000S35. Gap Pad 5000S35 is a fiberglass-reinforced gap filling material, featuring high thermal conductivity (5.0 W/m-K) for exceptionally low thermal resistance while maintaining low bulk hardness (35 Shore 00). This product's soft and compliant resin formulation is ideal for fragile components.

July 18, 2006 - Sil-Pad 1100ST

The Bergquist Company announces the rollout of its latest Soft Tack product, Sil-Pad 1100ST. Sil-Pad 1100ST features inherent tack on both sides and dual liners for easy placement and exceptional thermal performance (thermal impedance is 0.66ºC-in2/W at 50 psi). The material is fiberglass-reinforced and silicone-based, a thermal interface material designed specifically for high-volume auto-dispensing applications.

February 06, 2006 - Bergquist Releases Gap Filler 3500S35

The Bergquist Company announces the release of Gap Filler 3500S35, a technology-leading gap filling material that provides both exceptional thermal conductivity (3.6 W/m-K) and exceptional softness (Shore [00] - 32). No other product on the market features the same level of performance and conformability.