Who Is "Lucky Dog"?

Lucky is The Bergquist Company mascot. He's dependable, mature, stately, loyal and demonstrates a real "can-do" attitude.

Headlines at Bergquist

December 12, 2011 - The Bergquist Company Expands Prescott Facility The Bergquist Company is pleased to announce the expansion of its Prescott, Wisconsin Thermal Substrates operation. Groundbreaking for the 30,000 square foot expansion took place on October 15, 2010. Equipment has been purchased and installed for a second Thermal Clad® manufacturing line, which will produce the entire line of thermally conductive dielectric metal core PCB panels. In addition, an adjacent facility has been purchased, and the buildings have been connected, resulting in a facility of just under 100,000 square feet in Prescott. Read Press Release
October 31, 2011 - Gap Filler 1000SR Our new Gap Filler 1000SR is coming to a screen near you. To start its kick-off, we've created a liquid dispensing video. This short animated clip walks you through the typical automated dispensing process on an ECU (Electronic Control Unit). The intent is to display where our product "plays" and how it streamlines the assembly process. Our Gap Filler 1000SR adds the benefit of a high level of slump resistance that wasn't available before at a 1 W/m-k performance point. The new material is designed to maintain its shape, and remain in place as dispensed on the target surface. This givesthe customer the ultimate flexibility in component orientation during assembly. Learn More Play Video
September 27, 2011 - Gap Pad VO Ultra Soft Black Due to demand in the consumer marketplace,The Bergquist Company is pleased to announce that the very popular Gap Pad®VO Ultra Soft is now available in black.The new black version is identified as Gap Pad®VO Ultra Soft-B. Gap Pad®VO Ultra Soft-B is ideal in applications where tear down color is a priority to the customer. Learn More
March 16, 2011 Notice: Earthquake Impact to Supply Chain Statement View Statement
November 1, 2010 - Gap Pad VO Ultimate The Bergquist Company announces the launch of its latest Gap Pad® product – Gap Pad® VO Ultimate. Gap Pad® VO Ultimate maintains a highly conformable, elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. This fiberglass reinforced, silicone-based material is highly compliant and is ideal for decreasing stress on fragile electronic component leads and solder balls. Learn More
March 1, 2010 - T-Clad HPL Dielectric Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB line. HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements.This thin dielectric at 0.0015" (38μm) has an ability to withstand high temperatures with a glass transition of 185°C and phenomenal thermal performance of 0.30°C/W (RD 2018). Learn More
June 1, 2009 - Hi-Flow 330P The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials, Hi-Flow 330P. Hi-Flow 330P has excellent handling characteristics. With a polyimide film reinforcement, its top side is dry to the touch and its bottom side has a natural tack. The polyimide reinforcement gives Hi-Flow 330P high dielectric strenght and cut-through resistance. Hi-flow 330P's thermal performance is exceptional with a thermal impedance of 0.17ºC-in²/W at 50 psi. Learn More
April 1, 2009 - Bond-Ply 450 PA The Bergquist Company introduces the first in an innovative new line of pre-applied thermal interface materials to Thermal Clad substrates. Bond-Ply 450 PA is an un-reinforced, thermally conductive pressure sensitive adhesive tape and is the first of many pre-applied offerings to come. Previously, high temperatures associated with solder reflow prevented the application of adhesives prior to board population. Bond-Ply 450 PA features a backside release liner capable of withstanding the extreme heat of solder reflow while maintaining adhesion and release characteristics for easy application. Learn More
September 16, 2008 - Liqui-Bond SA 1800 (One Part) The Bergquist Company is excited to announce the addition of another high performance product, Liqui-Bond SA 1800, to its liquid silicone adhesive family. Liqui-Bond SA 1800 features both a high thermal conductivity (1.8 W/m-K) and a low viscosity, allowing for ease of screen or stencil application. The material is also well suited for high volume automated dispensing. Liqui-Bond SA 1800 is a one-part material that cures and bonds at elevated temperatures and eliminates the need for mechanical fasteners, reducing labor, cost and complexity. Learn More
August 01, 2008 - Hi-Flow 565U and 565UT The Bergquist Company introduces the latest in thermally conductive phase change materials, Hi-Flow 565U and Hi-Flow 565UT. Both materials perform like high-end thermal greases, yet can be applied in pad form, eliminating the mess and application headaches associated with grease. Hi-Flow 565U is dry to the touch and provided in tabulation form for easy placement. 565UT is naturally tacky and is also supplied in tabulation form. Hi-Flow 565U has a 52ºC phase change temperature. Hi-Flow 565UT has a phase change softening temperature of 52ºC to provide optimum wet out. These materials offer exceptional thermal performance (thermal impedance of 565U is 0.04ºC-in2/W at 25 psi and 565UT 0.05ºC-in²/W). Hi-Flows 565U and 565UT are unreinforced materials and are targeted for high performance applications compensating for varied surface finishes and flatness tolerances. Learn More
July 15, 2008 - Gap Pad 1500S30 The Bergquist Company announces the launch of its latest S-Class gap filling material - Gap Pad 1500S30. Gap Pad 1500S30 maintains a conformable, highly elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. This fiberglass-reinforced, silicone-based material is highly compliant and is ideal for decreasing strain on fragile component leads and solder balls. Learn More
December 01, 2007 - Gap Filler (Two-Part) The Bergquist Company announces the release of its latest liquid gap filling solution, Gap Filler 1500 (Two-Part). Gap Filler 1500 is a silicone based, two-component, room or elevated temperature cured product. As dispensed, this material is ultra-conforming and is ideal for filling unique and intricate air voids and gaps. As cured, Gap Filler 1500 is a soft, thermally conductive, form-in-place elastomer that is dry to the touch and will not pump-out from the interface. Gap Filler 1500 exhibits an excellent thermal performance (1.8W/m-K) and a high level of slump resistance. Learn More
April 06, 2007 - Sil-Pad 1200 The Bergquist Company announces the release of its latest Sil-Pad product, Sil-Pad 1200. Sil-Pad 1200 is a fiberglass-reinforced thermal interface material, featuring an optional adhesive coating. The material's smooth and non-tacky surface allows for efficient repositioning and ease of use. Sil-Pad 1200 is supplied without a liner in dry form and on a carrier liner when supplied with optional adhesive coating. Exceptional thermal performance is exhibited at both low and high application pressures (thermal impedance is 0.53° C -in²/W at 50 psi), making the product ideal for placement between electronic power devices and a heat sink in screw and clip mounted applications. Learn More
January 10, 2007 - Thermal Interface Materials and Cold Plates Bergquist assisted Lytron, manufacturer of cold plates, cooling systems, and heat exchangers, with an article on thermal interface materials for Lytron's customers. To be effective, all cold plates require intimate surface-to-surface contact with the component or board-to-be-cooled. Irregular surface areas, both on the electronic components and on the cold plate, prevent good contact. Hence, some type of thermally conductive interface material is necessary to fill the interstices between the mating surfaces. Learn More
January 07, 2007 - Gap Pad 2000SF The Bergquist Company welcomes the newest member to its Gap Pad family. Gap Pad 2000SF is a breakthrough silicone free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/m-K). While highly thermally conductive, the material stays exceptionally soft and more compliant than other silicone-free materials. Gap Pad 2000SF is capable of conforming to the most demanding contours while applying little or no stress on component leads. The unique rheology of Gap Pad 2000SF enables it to maintain its structural integrity throughout assembly and use. Learn More
July 25, 2006 - Gap Pad 5000S35 Bergquist introduces the newest member of the S-Class gap filling product: Gap Pad 5000S35. Gap Pad 5000S35 is a fiberglass-reinforced gap filling material, featuring high thermal conductivity (5.0 W/m-K) for exceptionally low thermal resistance while maintaining low bulk hardness (35 Shore 00). This product's soft and compliant resin formulation is ideal for fragile components. Learn More
July 18, 2006 - Sil-Pad 1100ST The Bergquist Company announces the rollout of its latest Soft Tack product, Sil-Pad 1100ST. Sil-Pad 1100ST features inherent tack on both sides and dual liners for easy placement and exceptional thermal performance (thermal impedance is 0.66ºC-in2/W at 50 psi). The material is fiberglass-reinforced and silicone-based, a thermal interface material designed specifically for high-volume auto-dispensing applications. Learn More
February 06, 2006 - Bergquist Releases Gap Filler 3500S35 The Bergquist Company announces the release of Gap Filler 3500S35, a technology-leading gap filling material that provides both exceptional thermal conductivity (3.6 W/m-K) and exceptional softness (Shore [00] - 32). No other product on the market features the same level of performance and conformability. Learn More