Application Notes

These documents contain a variety of information pertaining to the application of Bergquist products, including: application, removal, repair instructions and more.

5-Wire Touch Screens For Hand-Held Devices This document provides an overview of the advantages of Bergquist 5-Wire technology in hand-held applications		APN_0402_00_13_01.pdf
Application Note 080 Note on Solder Joint Durability		APN_080.pdf
Application Note 081 Note on Copper Substrates		APN_081.pdf
Application Note 112 Note on Measurement of Thermal Conductivity in Compliant Low Modulus Materials		APN_112_Rev.pdf
Application Note 116 Note on Gap Pad Modulus		APN_116.pdf
Gap Pad S-Class White Paper Thermal Performance & Silicone Extraction Advantages of Gap Pad S-Class Gap Filling Materials		PDF_GPSWhtSht_Singles.pdf
New Product News - Hi-Flow Dispenser Details on Bergquist's new Hi-Flow Dispenser.		NPN_0402_004_01.pdf
Pot Life Application Note		QA_PotLife_0408.pdf
Repair Instructions - Hi-Flow 225FT TAB STYLE Provides information on surface preparation and application instructions for material with tabbed applicators.		RPR_0402_002_01.pdf
Repair Instructions - Hi-Flow 225FT Provides information on surface preparation and application instructions.		RPR_0402_001_01.pdf
Thermal Clad Optimal Circuit Design White Paper This new 8-pade technical booklet is full of charts, photos and the right data that can guide you to the most optimally designed Thermal Clad circuit board.		T-Clad Optimal Design White Paper.pdf