Sil-Pad Gap Pad Bond-Ply Hi-Flow Phase Change Liquid Dispensed Materials Thermal Properties and Testing Awards and Certifications Selection Guide and Comparison Tables Compare Material Properties Part Number Builder LED Solutions Brochure Bergquist's Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Sil-Pad products are used by many of the world's largest OEMs in various industries including automotive, computer, power supply, military and motor control. SOLUTION FOR: -select a solution- Aerospace / Military Automotive Computer Consumer Electronics Motor Control Power Conversion Telecommunications SELECT A PRODUCT: -select a product- Bond-Ply 100 (5 mil) Bond-Ply 100 (8 mil) Bond-Ply 100 (11 mil) Bond-Ply 400 Bond-Ply 660B Gap Filler 1000 (Two-Part) Gap Filler 2000 (Two-Part) Gap Filler 1100 SF (Two-Part) Gap Filler 3500S35 (Two-Part) Gap Filler 1500 (Two-Part) Gap Pad 1000SF Gap Pad 1500 Gap Pad 1500R Gap Pad 1500S30 Gap Pad 2000S40 Gap Pad 2000SF Gap Pad 2500 Gap Pad 2500S20 Gap Pad 3000S30 Gap Pad 5000S35 Gap Pad A2000 Gap Pad A3000 Gap Pad HC1000 Gap Pad VO Gap Pad VO Soft Gap Pad VO Ultra Soft Hi-Flow 105 Hi-Flow 115-AC Hi-Flow 225 F-AC Hi-Flow 225U Hi-Flow 225UT Hi-Flow 225FT Hi-Flow 225UF Hi-Flow 300P 1.0 Hi-Flow 300G Hi-Flow 300P 1.5 Hi-Flow 300P 2.0 Hi-Flow 565U Hi-Flow 565UT Hi-Flow 625 Liqui Bond SA 2000 (one-part) Liqui Bond SA 1000 (one-part) Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10 Q-Pad 3 Q-Pad II Sil-Pad 1100ST (Soft Tack) Sil-Pad 1200 Sil-Pad 1500ST (Soft Tack) Sil-Pad 1750 Sil-Pad 2000 (10 mil) Sil-Pad 400 (7 mil) Sil-Pad 400 (9 mill) Sil-Pad 800 Sil-Pad 900S Sil-Pad 980 Sil-Pad A1500 Sil-Pad A2000 (15 mil) Sil-Pad A2000 (20 mil) Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Sil-Pad Shield Sil-Pad Tube TIC 1000A TIC 1000G TIC 4000 Comprehensive choices for a cleaner and more efficient thermal interface. Gap Pad products provide a complete range of choices for filling air gaps and enhancing thermal conductivity. Handy comparison tool for all Bergquist thermal materials. Automatically charts thermal resistance values and displays a material properties table of selected materials. Thermally conductive, acrylic based PSA bonding materials used to permanently mount a heat sink on top of a QFP, BGA and other popular package styles. These phase change materials are used for excellent thermal performance without the mess of grease Dispensing Thermal Interface Materials in liquid form with automated equipment can improve throughput, consistency and quality. Thermal Clad substrates minimize thermal impedance and conduct heat more efficiently than standard PWB's. Build your thermal materials part number by selecting the available material options... How thermal conductivity, resistance, and impedance affect your selection.

© 2008 The Bergquist Company. All rights reserved. legal statements | contact us | careers | about us