• Sil-Pad
  • Sil-Pad 400
  • Sil-Pad 800
  • Sil-Pad 900S
  • Sil-Pad 980
  • Sil-Pad 1100ST
  • Sil-Pad 1200
  • Sil-Pad A1500
  • Sil-Pad 1500ST
  • Sil-Pad 2000
  • Sil-Pad A2000
  • Sil-Pad K-4
  • Sil-Pad K-6
  • Sil-Pad K-10
  • Q-Pad II
  • Q-Pad 3
  • Poly-Pad 400
  • Poly-Pad 1000
  • Poly-Pad K-4
  • Poly-Pad K-10
  • Sil-Pad Tube
  • Sil-Pad Shield
  •  
• Gap Pad
  • Gap Pad VO
  • Gap Pad VO Soft
  • Gap Pad VO Ultra Soft
  • Gap Pad VO Ultra Soft-B
  • Gap Pad VO Ultimate
  • Gap Pad 1000SF
  • Gap Pad HC1000
  • Gap Pad 1500
  • Gap Pad 1500R
  • Gap Pad 1500S30
  • Gap Pad A2000
  • Gap Pad 2000S40
  • Gap Pad 2200SF
  • Gap Pad 2500S20
  • Gap Pad 2500
  • Gap Pad A3000
  • Gap Pad 3000S30
  • Gap Pad 5000S35
  • Gap Filler 1000
  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
• Bond-Ply
  • Bond-Ply 100
  • Bond-Ply 400
  • Bond-Ply 660P
  • Bond-Ply LMS500P
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
• Hi-Flow Phase Change
  • Hi-Flow 105
  • Hi-Flow 225F-AC
  • Hi-Flow 225UT
  • Hi-Flow 225U
  • Hi-Flow 625
  • Hi-Flow 300P
  • Hi-Flow 300G
  • Hi-Flow 565U
  • Hi-Flow 565UT
  • Hi-Flow 650P
  • TIC 1000A
  • TIC 4000
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
  • TIC 1000A
  • TIC 4000
• Thermal Properties and Testing
• Awards and Certifications
• Selection Guide and Comparison Tables
• Compare Material Properties
• Part Number Builder
• LED Solutions Brochure
• Compression Deflection Contour Plots

BP100

High performance, thermally conductive acrylic adhesive

Bond-Ply 100

Downloads
Selection Guide
Data Sheet
RoHS Certificate

Features and Benefits

• Thermal impedance 0.52°C-in²/W (@50 psi)
• High bond strength to a variety of surfaces
• Double-sided, pressure sensitive adhesive tape
• High performance, thermally conductive acrylic adhesive
• Can be used instead of heat-cure adhesive, screw mounting or clip mounting.

Typical Applications Include

• Mount heat sink onto BGA graphic processor or drive processor
• Mount heat spreader onto power converter PCB or onto motor control PCB