BP100
High performance, thermally conductive acrylic adhesive

Bond-Ply 100 (5 mil)
- Thermal impedance:
0.86°C-in2/W (@100 psi)
- High bond strength to a variety of surfaces
- Double-sided, pressure sensitive adhesive tape
- High performance, thermally conductive acrylic adhesive
- Can be used instead of heat cure adhesive, screw mounting or clip mounting.
Typical Applications Include
- Mount heat sink onto BGA graphic processor
- Mount heat sink onto drive processor
- Mount heat spreader onto power converter PCB
- Mount heat spreader onto motor control PCB