• Sil-Pad
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  • Q-Pad II
  • Q-Pad 3
  • Poly-Pad 400
  • Poly-Pad 1000
  • Poly-Pad K-4
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  • Sil-Pad Tube
  • Sil-Pad Shield
  •  
• Gap Pad
  • Gap Pad VO
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  • Gap Pad VO Ultra Soft
  • Gap Pad VO Ultra Soft-B
  • Gap Pad VO Ultimate
  • Gap Pad 1000SF
  • Gap Pad HC1000
  • Gap Pad 1500
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  • Gap Pad 1500S30
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  • Gap Pad 2000S40
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  • Gap Pad 2500
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  • Gap Pad 3000S30
  • Gap Pad 5000S35
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  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
• Bond-Ply
  • Bond-Ply 100
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• Hi-Flow Phase Change
  • Hi-Flow 105
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  • Hi-Flow 565U
  • Hi-Flow 565UT
  • Hi-Flow 650P
  • TIC 1000A
  • TIC 4000
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
  • TIC 1000A
  • TIC 4000
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BP100

High performance, thermally conductive acrylic adhesive

Bond-Ply 100 (8 mil)

Bond-Ply 100 (8 mil)

Downloads
Selection Guide
Data Sheet
RoHS Certificate

• Thermal impedance:
  0.86°C-in2/W (@100 psi)
• High bond strength to a variety of surfaces
• Double sided pressure sensitive adhesive tape
• High performance, thermally conductive acrylic adhesive
• Can be used instead of heat cure adhesive, screw mounting or clip mounting.

Typical Applications Include

• Mount heat sink onto BGA graphic processor
• Mount heat sink onto drive processor
• Mount heat spreader onto power converter PCB
• Mount heat spreader onto motor control PCB