• Sil-Pad
  • Sil-Pad 400 (7 mil)
  • Sil-Pad 400 (9 mil)
  • Sil-Pad 800
  • Sil-Pad 900S
  • Sil-Pad 980
  • Sil-Pad 1100ST
  • Sil-Pad 1200
  • Sil-Pad A1500
  • Sil-Pad 1500ST
  • Sil-Pad 1750
  • Sil-Pad 2000 (10 mil)
  • Sil-Pad A2000 (15 mil)
  • Sil-Pad A2000 (20 mil)
  • Sil-Pad K-4
  • Sil-Pad K-6
  • Sil-Pad K-10
  • Q-Pad II
  • Q-Pad 3
  • Poly-Pad 1000
  • Poly-Pad K-4
  • Poly-Pad K-10
  • Sil-Pad Tube
  • Sil-Pad Shield
  •  
• Gap Pad
  • Gap Pad VO
  • Gap Pad VO Soft
  • Gap Pad VO Ultra Soft
  • Gap Pad 1000SF
  • Gap Pad 2200SF
  • Gap Pad HC1000
  • Gap Pad 1500
  • Gap Pad 1500R
  • Gap Pad 1500S30
  • Gap Pad A2000
  • Gap Pad 2000S40
  • Gap Pad 2500S20
  • Gap Pad 2500
  • Gap Pad A3000
  • Gap Pad 3000S30
  • Gap Pad 5000S35
  • Gap Filler 1000
  • Gap Filler 1100 SF
  • Gap Filler 2000
  • Gap Filler 1500
  • Gap Filler 3500S35
  •  
• Bond-Ply
  • Bond-Ply 100 (5 mil)
  • Bond-Ply 100 (8 mil)
  • Bond-Ply 100 (11 mil)
  • Bond-Ply 400
  • Bond-Ply 450
  • Bond-Ply 660B
  • Bond-Ply 660P
  • Liqui Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui Bond SA 2000
• Hi-Flow Phase Change
  • Hi-Flow 105
  • Hi-Flow 225
  • Hi-Flow 225FT
  • Hi-Flow 225UT
  • Hi-Flow 225U
  • Hi-Flow 565U
  • Hi-Flow 565UT
  • Hi-Flow 625
  • Hi-Flow 300P
  • Hi-Flow 300G
  • Hi-Flow 330P
  • TIC 1000A
  • TIC 4000
  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
  • TIC 1000A
  • TIC 4000
• Thermal Properties and Testing
• Awards and Certifications
• Selection Guide and Comparison Tables
• Compare Material Properties
• Part Number Builder
• LED Solutions Brochure
• Compression Deflection Estimator

BP100

High performance, thermally conductive acrylic adhesive

Bond-Ply 400

Bond-Ply 400

Downloads
Selection Guide
Data Sheet
RoHS Certificate
/span>

• Thermal performance:
  5.4 °C/W (1)
• Easy Application
• Eliminates need for external hardware
  (screws, clips, etc.)
• Available with easy release tabs

Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain high bond strength to a variety of “low energy” surfaces, including many plastics, while maintaining high bond strength with long term exposure to heat and high humidity.

Typical Applications Include

Secure:

• Heat sink onto BGA graphic processor
• Heat sink to computer processor 
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB