
Typical Properties of Bond-Ply 660P |
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| Property | Imperial Value |
Metric Value |
Test Method |
| Color | Light Brown |
Light Brown |
Visual |
| Reinforcement Carrier | Polyimide Film |
Polyimide Film |
*** |
| Thickness (inch) / (mm) | 0.008 |
0.203 |
ASTM D374 |
| Glass Transition (ºF) / (ºC) | -22 |
-30 |
ASTM 1356 |
| Continuous Use Temp (ºF) / (ºC) | -22 to 248 |
-30 to 120 |
*** |
| Adhesion | |||
| Lap Shear @ RT (psi) / (MPa) | 100 |
0.7 |
ASTM D1002 |
| Lap Shear after 5 hr @ 100ºC | 200 |
1.4 |
ASTM D1002 |
| Lap Shear after 2 min. @ 200ºC | 200 |
1.4 |
ASTM D1002 |
| Electrical | Value | Test Method |
|
| Dielectric Breakdown Voltage (Vac) | 6000 |
ASTM D149 |
|
| Flame Rating | V-O |
U.L. 94 |
|
| Thermal | |||
| Post-Cured Thermal Conductivity (W/m-K) | 0.4 |
ASTM D5470 |
|
| Thermal Performance vs Pressure | |||
| Initial Assembly Pressure (psi for 5 seconds) | 10 |
25 |
50 |
100 |
200 |
| TO-220 Thermal Performance (°C/W) | 5.48 |
5.47 |
5.15 |
5.05 |
5.00 |
| Thermal Impedance (°C-in2/W) (1) | 0.83 |
0.82 |
0.81 |
0.80 |
0.79 |
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. |
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