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Thermal Materials
  • Sil-Pad
    • Sil-Pad 400
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    •  
  • Gap Pad
    • Gap Pad VO
    • Gap Pad VO Soft
    • Gap Pad VO Ultra Soft
    • Gap Pad VO Ultra Soft-B
    • Gap Pad VO Ultimate
    • Gap Pad 1000SF
    • Gap Pad HC1000
    • Gap Pad 1500
    • Gap Pad 1500R
    • Gap Pad 1500S30
    • Gap Pad A2000
    • Gap Pad 2000S40
    • Gap Pad 2200SF
    • Gap Pad 2500S20
    • Gap Pad 2500
    • Gap Pad A3000
    • Gap Pad 3000S30
    • Gap Pad 5000S35
    • Gap Filler 1000
    • Gap Filler 1000SR
    • Gap Filler 1100SF
    • Gap Filler 1500
    • Gap Filler 2000
    • Gap Filler 3500S35
  • Bond-Ply
    • Bond-Ply 100
    • Bond-Ply 400
    • Bond-Ply 660P
    • Liqui-Bond SA 1000
    • Liqui-Bond SA 1800
    • Liqui-Bond SA 2000
  • Hi-Flow Phase Change
    • Hi-Flow 105
    • Hi-Flow 225F-AC
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    • Hi-Flow 565U
    • Hi-Flow 565UT
    • Hi-Flow 650P
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    • TIC 4000
  • Liquid Dispensed Materials
    • Gap Filler 1000
    • Gap Filler 1000SR
    • Gap Filler 1100SF
    • Gap Filler 1500
    • Gap Filler 2000
    • Gap Filler 3500S35
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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad Products

The Bergquist Company developed the Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application.

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present.  Gap Pad provides:

  • Elimination of air gaps to reduce thermal resistance
  • High conformability to reduce interfacial resistance
  • Low-stress vibration dampening
  • Compatible with automated dispensing equipment


Gap Pad VO Soft
Highly Conformable, Thermally Conductive Material for Filling Air Gaps

Gap Pad VO
Conformable, Thermally Conductive Material for Filling Air Gaps

Gap Pad VO Ultra Soft
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps

Gap Pad VO Ultra Soft Black
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps

Gap Pad VO Ultimate
Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material

Gap Pad 1000SF
Thermally Conductive, Silicone-Free Gap Filling Material

Gap Pad 2200SF
Thermally Conductive, Silicone-Free Gap Filling Material

Gap Pad HC1000
“Gel-Like” Modulus Gap Filling Material

Gap Pad 1500
Thermally Conductive, Unreinforced Gap Filling Material

Gap Pad 1500R
Thermally Conductive, Reinforced Gap Filling Material

Gap Pad 1500S30
Highly Conformable, Thermally Conductive, Reinforced "S-Class" Gap Filling Material

Gap Pad A2000
High Performance, Thermally Conductive Gap Filling Material

Gap Pad 2000S40
Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material

Gap Pad 2500S20
Thermally Conductive, Reinforced “S-Class” Gap Filling Material

Gap Pad 2500
Thermally Conductive, Unreinforced Gap Filling Material

Gap Pad A3000
Thermally Conductive, Reinforced Gap Filling Material

Gap Pad 3000S30
Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

Gap Pad 5000S35
High thermal conductivity plus "S-Class" softness and conformability.

Gap Filler 1000 (Two-Part)
Thermally Conductive, Liquid Gap Filling Material

Gap Filler 1000SR (Two-Part)
Thermally Conductive, Superior Slump Resistance, Liquid Gap Filling Material

Gap Filler 1100 SF (Two-Part)
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material

Gap Filler 2000 (Two-Part)
High Thermally Conductive, Liquid Gap Filling Material

Gap Filler 1500 (Two-Part)
A two-part, high performance, thermally conductive liquid gap filling material.

Gap Filler 3500S35 (Two-Part)
Thermally Conductive Liquid Gap Filling Material

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Thermal Interface Material
18930 W. 78th Street
Chanhassen, MN 55317 USA
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