LB SA1800

Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer.

Gap Filler 1000

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Gap Filler 1000 (Two-Part)

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Thermal conductivity: 1.0 W/m-K
Ultra-conforming, designed for fragile and low-stress applications
Ambient and accelerated cure schedules
100% Solids – no cure by-products
Excellent low and high temperature mechanical and chemical stability

Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a balance of cured material properties highlighted by “gel-like” modulus and good compression set (memory). The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. Unlike cured gap filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 1000 is intended for use in thermal interface applications when a strong structural bond is not required.

Note: Resultant thickness is defined as the final gap thickness of the application.

Gap Filler 1000 is supplied as a two-part kit comprised of Part A and Part B components. The two components are colored to assist as a mix indicator (1:1 ratio by weight or volume). The mixed system will cure at either ambient or elevated temperature to form a soft thermally conductive interface material. Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications.

Gap Filler 1000 is intended for use in thermal interface applications where a structural bond is not a requirement. This material is formulated for low cohesive strength and “gel-like” properties.

Typical Applications Include

Automotive electronics
Telecommunications
Computer and peripherals
Between any heat generating semiconductor and a heat sink
As a thermally conductive vibration dampening material