Features and Benefits
Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a balance of cured material properties highlighted by low modulus and good compression set (memory). The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, Gap Filler 1000 flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. Unlike cured gap filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 1000 is intended for use in thermal interface applications when a strong structural bond is not required.
Typical Applications Include