LB SA1800

Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer.

Gap Filler 1100SF

Features & Benefits Properties Configurations Product Family FAQ's

Gap Filler 1100 SF
(Two-Part)

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Halogen Testing Report

Features and Benefits

Thermal Conductivity: 1.1 W/m-k
No silicone outgassing or extraction
Ultra-conforming, designed for fragile and low-stress applications
Ambient and accelerated cure schedules
100% solids – no cure by-products

Gap Filler 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component curing at room or elevated temperatures. The material exhibits low modulus properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications.

The two components are colored to assist as a mix indicator (1:1 by volume). The mixed system will cure at ambient temperature. Unlike cured thermal pad materials, the liquid approach offers infinite thickness variations with little or no stress during assembly displacement. Gap Filler 1100SF, although exhibiting some natural tack characteristics, is not intended for use in thermal interface applications requiring a mechanical structural bond

Application
Gap Filler 1100SF can be mixed and dispensed using dual-tube cartridge packs with static mixers and manual or pneumatic gun or high volume mixing and dispensing equipment (application of heat may be used to reduce viscosity).

Temperature Dependence of Viscosity

The viscosity of the Gap Filler 1100SF material is temperature dependent. The table below provides the multiplication factor to obtain viscosity at various temperatures. To obtain the viscosity at a given temperature, look up the multiplication factor at that temperature and multiply the corresponding viscosity at 25°C.

Temperature	Multiplication Factor
°C	Part A	Part B
20	1.43	1.57
25	1.00	1.00
35	0.58	0.50
45	0.39	0.30
50	0.32	0.24

Example - Viscosity of Part A @ 45°:
Viscosity of Part A at 25°C is 450,000 cp. The multiplication factor for part A at 45°C is 0.39. Therefore:
(450,000) x (0.39) = 175,500 cps

Typical Applications Include

Silicone-sensitive optic components
Silicone-sensitive electronics
Filling various gaps between heat-generating devices to heat sinks and housing
Mechanical switching relay
Hard disk assemblies
Dielectric for bare-leaded devices