
Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly. Gap Filler 1500 exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required. As cured, Gap Filler 1500 provides a soft, thermally conductive, form-in-place elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps.
Typical Applications Include