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LB SA1800

Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer.

Gap Filler 2000

Gap Filler 2000 (Two-Part)

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note Gap Filler 2000

• Thermal conductivity: 2.0 W/m-K
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• 100% Solids – no cure by-products
• Excellent low and high temperature mechanical and chemical stability

Gap Filler 2000 is a high performance, thermally conductive liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, thermally conductive, form-inplace elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch.

The mixed system (1:1 ratio) will cure at either ambient or elevated temperature to form a soft, thermally conductive interface material. Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications.

Gap Filler 2000 is intended for use in thermal interface applications when a strong structural bond is not required. Gap Filler 2000 is formulated for low modulus,"gel-like" properties.
Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include

• Automotive electronics
• Telecommunications
• Computer and peripherals
• Between any heat generating semiconductor and a heat sink
• As a thermally conductive vibration dampening material