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  •  
• Gap Pad
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  •  
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  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad 1000SF

Gap Pad 1000SF

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note 116

• Thermal conductivity: 0.9 W/m-K
• No silicone outgassing
• No silicone extraction
• Reduced tack on one side to aid in application assembly

Gap Pad 1000SF is a thermally conductive, electrically-insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high stand-off and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material.

The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material.

Typical Applications Include

• Digital disk drives
• Automotive modules
• Fiber optics modules