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  •  
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  • TIC 1000A
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  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad 1500R

Gap Pad 1500R

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note 116

• Thermal conductivity: 1.5 W/m-K
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction 
• Electrically isolating

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear, and tear resistance. The tacky nature of both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.

The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material.

Typical Applications Include

• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader