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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad 1500R

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Halogen Testing Report
Application Note 116

Features and Benefits

• Thermal conductivity: 1.5 W/m-K
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction 
• Electrically isolating

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include

• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Area where heat needs to be transferred to a frame chassis, or other type of heat spreader