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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad 2000S40

Gap Pad 2000S40

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note 116
Gap Pad S-Class White Paper

• Thermal conductivity: 2.0 W/mK
• Low "S-Class" thermal resistance at very low pressures
• Highly conformable, low hardness
• Designed for low stress applications
• Fiberglass reinforced for puncture, shear and tear resistance
Gap Pad 2000S40 is recommended for low-stress applications that require a mid- to high-thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces, and high stack-up tolerances.

Gap Pad 2000S40 is electrically isolating, thus well-suited for applications requiring electrical isolation between heat sinks and high voltage, bare leaded devices. Gap Pad 2000S40 is a filled, thermally conductive polymer reinforced with a fiberglass carrier on one side, allowing for easy material handling and enhanced puncture, shear, and tear resistance.
Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:
• Power electronics DC/DC, 1/4, 1/2, full bricks, etc.
• Mass storage devices
• Graphics card/processor
• Wireline/wireless communications hardware
• Automotive engine/transmission controls