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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad 2500

Gap Pad 2500

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note 116

• Thermal conductivity: 2.7 W/m-K
• High thermal performance, cost-effective solution
• Unreinforced construction for additional compliancy
• Medium compliancy and conformability

Gap Pad 2500 is a thermally conductive, electrically insulating, unreinforced gap filling material. Gap Pad 2500 is a filled polymer material yielding a soft yet elastic polymer that allows for easy handling and converting without the need for reinforcement. Gap Pad 2500 material is conformable yet elastic, allowing for excellent wet-out and interfacing characteristics to surfaces with roughness and/or topography. All these characteristics make this material ideal for low and mid pressure applications that use either clip or screw mounted assembly.
Gap Pad 2500 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides of the material. Gap Pad 2500 is available in thickness of 0.020" to 0.125".

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include

• Multiple heat generating components to a common heat sink
• Graphics Chips to heat sinks
• Processors to heat sinks
• Mass Storage Drives
• Wireline / Wireless Communications Hardware