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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad 2500S20

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Halogen Testing Report
Application Note 116
Gap Pad S-Class White Paper

Features and Benefits

• Thermal conductivity: 2.4 W/m-K
• Low "S-Class" thermal resistance at ultra-low pressures
• Ultra conformable, “gel-like” modulus
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear and tear resistance

Gap Pad 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K. The material is a filled-polymer material yielding extremely soft, elastic characteristics. The material is reinforced to provide easy handling and converting, added electrical isolation and tear resistance. Gap Pad 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting. The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

Gap Pad 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications

• Between processors and heat sinks
• Between graphics chips and heat sinks
• DVD andCDROM electornics cooling
• Areas where heat needs to be transferred toa frame, chassis or other type of heat spreader