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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad 3000S30

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Application Note 116
Gap Pad S-Class White Paper

Features and Benefits

• Thermal conductivity: 3.0 W/m-k
• Low "S-Class" thermal resistance at very low pressures
• Highly conformable, "S-Class" softness
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear, and tear resistance

Gap Pad 3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-k. The material offers exceptional thermal performance at low pressures due to an all-new 3 W/m-k filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. Gap Pad 3000S30 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

Gap Pad 3000S30 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The material's natural inherent tack allows for stick-in-place characteristics durnig assembly. Gap Pad 3000S30 is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications

• Processors
• Server S-RAMs
• Mass storage drives
• Notebook computers
• BGA packages
• Power conversion