• Sil-Pad
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• Gap Pad
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  •  
• Bond-Ply
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  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad A3000

Gap Pad A3000

Selection Guide
Data Sheet
RoHS Certificate
Application Note 116

• Thermal conductivity: 3.0 W/m-K
• Fiberglass reinforced for puncture, shear and tear resistance
• Reduced tack on one side to aid in application assembly
• Electrically isolating

Gap Pad A3000 is a thermally conductive filled polymer laminate, supplied on a reinforcing mesh for easy material handling and enhanced puncture, shear, and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in burn-in and rework processes while the light gold and soft side of the material allows for added compliance.

The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material.

Typical Applications Include

• Computer and peripherals
• Telecommunications
• Heat Pipe assemblies
• RDRAM™ memory modules
• CDROM / DVD cooling
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
• Between CPU and heat spreader