• Sil-Pad
  • Sil-Pad 400 (7 mil)
  • Sil-Pad 400 (9 mil)
  • Sil-Pad 800
  • Sil-Pad 900S
  • Sil-Pad 980
  • Sil-Pad 1100ST
  • Sil-Pad 1200
  • Sil-Pad A1500
  • Sil-Pad 1500ST
  • Sil-Pad 1750
  • Sil-Pad 2000 (10 mil)
  • Sil-Pad A2000 (15 mil)
  • Sil-Pad A2000 (20 mil)
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  • Poly-Pad 1000
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  • Poly-Pad K-10
  • Sil-Pad Tube
  • Sil-Pad Shield
  •  
• Gap Pad
  • Gap Pad VO
  • Gap Pad VO Soft
  • Gap Pad VO Ultra Soft
  • Gap Pad 1000SF
  • Gap Pad 2200SF
  • Gap Pad HC1000
  • Gap Pad 1500
  • Gap Pad 1500R
  • Gap Pad 1500S30
  • Gap Pad A2000
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  • Gap Pad 2500
  • Gap Pad A3000
  • Gap Pad 3000S30
  • Gap Pad 5000S35
  • Gap Filler 1000
  • Gap Filler 1100 SF
  • Gap Filler 2000
  • Gap Filler 1500
  • Gap Filler 3500S35
  •  
• Bond-Ply
  • Bond-Ply 100 (5 mil)
  • Bond-Ply 100 (8 mil)
  • Bond-Ply 100 (11 mil)
  • Bond-Ply 400
  • Bond-Ply 450
  • Bond-Ply 660B
  • Bond-Ply 660P
  • Liqui Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui Bond SA 2000
• Hi-Flow Phase Change
  • Hi-Flow 105
  • Hi-Flow 225
  • Hi-Flow 225FT
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  • Hi-Flow 225U
  • Hi-Flow 565U
  • Hi-Flow 565UT
  • Hi-Flow 625
  • Hi-Flow 300P
  • Hi-Flow 300G
  • Hi-Flow 330P
  • TIC 1000A
  • TIC 4000
  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
  • TIC 1000A
  • TIC 4000
• Thermal Properties and Testing
• Awards and Certifications
• Selection Guide and Comparison Tables
• Compare Material Properties
• Part Number Builder
• LED Solutions Brochure
• Compression Deflection Estimator

GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad HC 1000

Gap Pad HC1000

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note 116

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-Like” modulus
• Fiberglass reinforced for puncture, shear and tear resistance

Gap Pad HC 1000 is an extremely conformable low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material.

The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material.

Typical Applications Include

• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• RDRAM™ memory modules / chip scale packages
• CDROM / DVD cooling
• Area where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules