• Sil-Pad
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  •  
• Gap Pad
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  •  
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  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad VO

Gap Pad VO

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note 116

• Thermal conductivity: 0.8 W/m-K
• Enhanced puncture, shear, and tear resistance
• Easy material handling
• Electrically isolating

Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.

The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material.




Typical Applications Include

• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat generating semiconductors and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
• Between heat generating magnetic components and a heat sink