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GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad VO Soft

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Halogen Testing Report
Application Note 116

Features and Benefits

• Thermal conductivity: 0.8 W/m-K
• Conformable, low hardness
• Enhanced puncture, shear and tear resistance
• Electrically isolating

Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a leaded device.

Note: Resultant thickness is defined as the final gap thickness of the application.



Typical Applications Include

• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader