• Sil-Pad
  • Sil-Pad 400 (7 mil)
  • Sil-Pad 400 (9 mil)
  • Sil-Pad 800
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  • Sil-Pad 1200
  • Sil-Pad A1500
  • Sil-Pad 1500ST
  • Sil-Pad 1750
  • Sil-Pad 2000 (10 mil)
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  • Sil-Pad A2000 (20 mil)
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  • Poly-Pad K-10
  • Sil-Pad Tube
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  •  
• Gap Pad
  • Gap Pad VO
  • Gap Pad VO Soft
  • Gap Pad VO Ultra Soft
  • Gap Pad 1000SF
  • Gap Pad 2200SF
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  • Gap Pad 1500
  • Gap Pad 1500R
  • Gap Pad 1500S30
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  • Gap Filler 2000
  • Gap Filler 1500
  • Gap Filler 3500S35
  •  
• Bond-Ply
  • Bond-Ply 100 (5 mil)
  • Bond-Ply 100 (8 mil)
  • Bond-Ply 100 (11 mil)
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  • Bond-Ply 450
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  • Bond-Ply 660P
  • Liqui Bond SA 1000
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  • Liqui Bond SA 2000
• Hi-Flow Phase Change
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  • TIC 1000A
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  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
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• Thermal Properties and Testing
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• Compression Deflection Estimator

GP1500S30

Gap Pad 1500S30 is a highly compliant material that is ideal for fragile component leads.

Gap Pad VO Ultra Soft

Gap Pad VO Ultra Soft

Downloads
Selection Guide
Data Sheet
RoHS Certificate
Application Note 116

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• "Gel-like" modulus 
• Designed for low-stress applications
• Puncture, shear and tear resistant

Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. Gap Pad VO Ultra Soft is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high voltage, bare leaded devices.


The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material.



Typical Applications Include

• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat generating semiconductors and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
• Between heat generating magnetic components and a heat sink