Hi-Flow 650P

Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film.

Hi-Flow Products

Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between CPU or power devices and a heat sink. Hi-Flow materials change from a solid at specific temperatures and flow to assure total wet-out of the interface without overflow. Hi-Flow provides:

A replacement to grease, saving time and money without sacrificing thermal performance
No mess- thixotropic characteristics keep it from flowing out of the interface
Easier handling- not tacky at room temperature
Simplified application process with many tabbed configurations

Hi-Flow 105
Phase Change Coated Aluminum

Hi-Flow 225
F-AC Reinforced, Phase Change Thermal Interface Material

Hi-Flow 225UT
Non-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material

Hi-Flow 225U
Non-Reinforced Phase Change Thermal Interface Material

Hi-Flow 300P
Electrically Insulating,Thermally Conductive Phase Change Material

Hi-Flow 300G
Fiberglass-Reinforced, Phase Change Thermal Interface Material

Hi-Flow 330P
Electrically Insulating, High Performance, Thermally Conductive Phase Change Material

Hi-Flow 565U
High Performance, Unreinforced Phase Change Thermal Interface Material

Hi-Flow 565UT
Tacky, High Performance, Unreinforced Phase Change Thermal Interface Material

Hi-Flow 625
Electrically Insulating, Thermally Conductive Phase Change Material

Hi-Flow 650P
Electrically Insulating, High Performance, Thermally Conductive Phase Change Material

TIC 1000A
High Performance, Value Compound for High-End Computer Processors

TIC 4000
High Performance Thermal Interface Compound for Copper-Based Heat Sinks