Hi-Flow 225F-AC

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Hi-Flow 225 F-AC

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Thermal impedance: 0.10°C-in2/W (@25 psi)
Can be manually or automatically applied to the surfaces of room temperature heat sinks
Foil reinforced, adhesive coated
Soft, thermally conductive 55°C phase change compound

Hi-Flow 225F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. Hi-Flow 225F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.

Above the 55°C phase change temperature, Hi-Flow 225F-AC wets out the thermal interface surfaces and flows to produce low thermal impedance.

Hi-Flow 225F-AC requires pressure from the assembly to cause material flow. The Hi-Flow coatings resist dripping in vertical orientation.

The material will include a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact Product Management for applications that are less than 0.07” square.

Typical Applications Include

Computer and peripherals
Power conversion
High performance computer processors
Power semiconductors
Power modules