Hi-Flow 225FT

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Hi-Flow 225FT

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Thermal impedance: 0.10°C-in2/W (@25 psi)
Reworkable pressure sensitive
Tabbed parts for easy application
Compliant foil allows easy release and re-work

Bergquist reworkable Hi-Flow 225FT thermal interface material provides a low thermal resistance path between hot components such as high performance processors and heat sinks. The material consists of a 55°C phase change compound bonded to one side of a conformable metal foil. This pressure sensitive material is easily applied to the heat sink and securely conforms to many mounting surfaces. Its compliant foil allows for easy release and reworking without leaving residue on CPU surfaces.

Above the 55°C phase change temperature, Hi-Flow 225FT wets-out the heat sink interface and flows to produce exceptional thermal performance. The thixotropic design of Hi-Flow 225FT requires pressure of the assembly to cause displacement and/or flow.

Typical Applications Include

Computer and peripherals
High performance computer processors
Burn in testing
Heat pipes
Mobile processors

Application Methods:

Hi-Flow 225FT pads are easily removed from the carrier liner and can be hand-applied to a room temperature heat sink, foil-side exposed. To re-position the heat sink assembly, simply lift gently to remove and re-apply.