Hi-Flow 225U

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Hi-Flow 225U

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Thermal impedance: 0.07°C-in2/W (@25 psi)
Hi-Flow coating will resist dripping
Thermally conductive 55°C phase change compound
Available in roll form with kiss-cut parts

Hi-Flow 225U is designed as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier.

Above its phase change temperature, Hi-Flow 225U wets out the thermal interface surfaces and flows to produce low thermal impedance. Hi-Flow 225U requires pressure of the assembly to cause flow.

Typical Applications Include

Computer and peripherals
High performance computer processors
Graphic cards
Power modules

Application Methods:

Hand-apply to 35-45 °C heat sink. The heat sink is heated in an oven or via heat gun to between 35 - 45 °C, and then the Hi-Flow 225U part is applied like an adhesive pad. The heat sink is cooled to room temperature and packaged. A protective tab liner remains in place until unit is it is ready for final assembly. The protective tab can be readily removed from the applied Hi-Flow 225U pad at a maximum temperature of 28 °C.

Automated equipment with 30-psi pressure. A pick and place automated dispensing unit can be used to apply the Hi-Flow 225U pad to a room temperature heat sink. The placement head should have a silicone rubber pad, and should apply approximately 30-psi pressure to the pad on transfer to the 25 – 35 °C heat sink. Once applied, the protective tab can be readily removed from the Hi-Flow 225U pad at a maximum temperature of 28 °C.