Hi-Flow 225UT

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Hi-Flow 225UT

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Thermal impedance: 0.08°C-in2/W (@25 psi)
55°C phase change composite with inherent tack characteristics
High visibility protective tabs
Pressure sensitive phase change thermal interface material

Hi-Flow 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow 225UT is a thermally conductive 55°C phase change composite with inherent tack. The material is supplied on a polyester carrier liner and is available with high visibility protective tabs.

Above its phase change temperature, Hi-Flow 225UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow. Hi-Flow 225UT coatings will resist dripping.

Typical Applications Include

Computer and peripherals
High performance computer processors
Graphic cards
Power modules

Application Methods:

Hand-apply Hi-Flow 225UT to a room temperature heat sink. The Hi-Flow 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly.