Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film.

Hi-Flow 225U

Hi-Flow 225U

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Selection Guide
Data Sheet
Standard Configuration (Metric)
Standard Configuration (Imperial)
RoHS Certificate

Typical Properties of Hi-Flow 225U
Property	Imperial Value	Metric Value	Test Method
Color	Black	Black	Visual
Reinforcement Carrier	None	None	***
Thickness (inch) / (mm)	0.0015	0.036	ASTM D374
Continuous Use Temp (°F) / (°C)	302	150	***
Phase Change Temp (°F) / (°C)	131	55	ASTM D3418
Electrical
Flame Rating	V-O	V-O	U.L. 94
Thermal
Thermal Conductivity (W/m-K) (1)	1.0	1.0	ASTM D5470
Thermal Performance vs Pressure

Pressure (psi)	10	25	50	100	200
TO-220 Thermal Performance (ºC/W)	0.53	0.47	0.39	0.34	0.32
Thermal Impedance (ºC-in²/W) (2)	0.08	0.07	0.06	0.05	0.04
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.