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Hi-Flow 650P

Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film.

Hi-Flow 565U

Downloads
Selection Guide
Data Sheet
RoHS Certificate
RoHS Certificate (CofC)
Halogen Testing Report

Features and Benefits

• Thermal impedance: 0.04°C-in²/W (@25 psi)
• Very high thermal conductivity: 3.5 W/mK
• 52°C phase change temperature
• Unsupported

Hi-Flow 565U is a thermally conductive phase change material which is applied in tabulated pad form. In the application the easy to use material undergoes a phase change at 52°C. After phase change, Hi-Flow 565U wets out the thermal interfaces resulting in a very low thermal impedance.

Hi-Flow 565U displaces easily at low pressures to provide a thermal performance comparable to the best thermal greases. Hi-Flow 565U is provided at a consistent thickness to ensure reliable performance. Hi-Flow 565U is attached to the target surface via pressure from a hard rubber roller or squeegee.

Typical Applications Include

• Processor lid to heat sink
• Processor die to lid or heat sink 
• FBDIMM to heat spreader