Hi-Flow TIC 1000A

Features & Benefits Properties Configurations Product Family FAQ's

TIC 1000A

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Selection Guide
Data Sheet
RoHS Certificate

Features and Benefits

High thermal performance: 0.32° C/W (TO-220 thermal test @ 50 psi)
Good screenability
Room temperature storage
No post "cure" required
Exceptional value

TIC 1000A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer or graphic processor and a heat sink. Other high watt density applications will also benefit from the extremely low thermal impedance of TIC 1000A.

TIC 1000A compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The compound requires pressure of the assembly to cause flow. The TIC 1000A compound will resist dripping.

For microprocessor applications, traditional screw fastening or spring clamping methods will provide adequate force to optimize the thermal performance of TIC 1000A.

An optimized application would utilize the minimum volume of TIC 1000A material necessary to ensure complete wet-out of both mechanical interfaces.

Assembly - No Post Screen Cure
TIC 1000A has good screenability. No solvent is used to reduce the viscosity, so no post "cure" conditioning is required.

Application Cleanliness
It is recommended to pre-clean heat sink and component interface with Isopropyl alcohol prior to assembly or repair. Ensure heat sink is dry before applying TIC 1000A.

Application Methods
1. Dispense and/or screen print TIC 1000A compound onto the processor or heat sink surface like thermal grease (see a Bergquist Representative for application information).
2. Assemble the processor and heat sink with spring clips or constant-pressure fasteners.