Hi-Flow 650P

Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film.

TIC 4000

Features & Benefits Properties Configurations Product Family FAQ's

TIC 4000

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Selection Guide
Data Sheet
RoHS Certificate
Halogen Testing Report

Features and Benefits

Thermal conductivity: 4.0 W/m-K
Exceptional thermal performance: 0.19C/W @ 50 psi

TIC 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of TIC 4000.

TIC 4000 compound wets out the thermal interface surfaces and flows to produce low thermal impedance. The compound requires pressure of the assembly to cause flow. TIC 4000 compound will not drip.

For a typical 0.5" x 0.5" application at 0.005" thick, Bergquist estimates approximately 0.02 ml (cc) of TIC 4000.

Although Bergquist estimates a 0.02 ml (cc) volumetric requirement for a 0.5" x 0.5" component interface, dispensed at a thickness of 0.005", Bergquist also recognizes that an optimized application would utilize the minimum volume of TIC 4000 material necessary to ensure complete wet-out of both mechanical interfaces.

Application Methods
1. Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair. Ensure heat sink is dry before applying TIC 4000.
2. Dispense TIC 4000 compound onto the processor or heat sink surface like thermal grease.
3. Assemble the processor and heat sink with clip or constant-pressure fasteners.

Typical Applications Include

High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of TIC 4000)
High watt density applications where the lowest thermal resistance interface is required