• Sil-Pad
  • Sil-Pad 400
  • Sil-Pad 800
  • Sil-Pad 900S
  • Sil-Pad 980
  • Sil-Pad 1100ST
  • Sil-Pad 1200
  • Sil-Pad A1500
  • Sil-Pad 1500ST
  • Sil-Pad 2000
  • Sil-Pad A2000
  • Sil-Pad K-4
  • Sil-Pad K-6
  • Sil-Pad K-10
  • Q-Pad II
  • Q-Pad 3
  • Poly-Pad 400
  • Poly-Pad 1000
  • Poly-Pad K-4
  • Poly-Pad K-10
  • Sil-Pad Tube
  • Sil-Pad Shield
  •  
• Gap Pad
  • Gap Pad VO
  • Gap Pad VO Soft
  • Gap Pad VO Ultra Soft
  • Gap Pad VO Ultra Soft-B
  • Gap Pad VO Ultimate
  • Gap Pad 1000SF
  • Gap Pad HC1000
  • Gap Pad 1450
  • Gap Pad 1500
  • Gap Pad 1500R
  • Gap Pad 1500S30
  • Gap Pad A2000
  • Gap Pad 2000S40
  • Gap Pad 2200SF
  • Gap Pad 2500S20
  • Gap Pad 2500
  • Gap Pad A3000
  • Gap Pad 3000S30
  • Gap Pad 5000S35
  • Gap Filler 1000
  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 1500LV
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Gap Filler 4000
• Bond-Ply
  • Bond-Ply 100
  • Bond-Ply 400
  • Bond-Ply 660P
  • Bond-Ply LMS 500P
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
• Hi-Flow Phase Change
  • Hi-Flow 105
  • Hi-Flow 225F-AC
  • Hi-Flow 225UT
  • Hi-Flow 225U
  • Hi-Flow 625
  • Hi-Flow 300P
  • Hi-Flow 300G
  • Hi-Flow 565U
  • Hi-Flow 565UT
  • Hi-Flow 650P
  • TIC 1000A
  • TIC 4000
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 1500LV
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Gap Filler 4000
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
  • Liqui-Form 2000
  • TIC 1000A
  • TIC 4000
• Thermal Properties and Testing
• Awards and Certifications
• Selection Guide and Comparison Tables
• Compare Material Properties
• Part Number Builder
• LED Solutions Brochure
• Compression Deflection Contour Plots

Hi-Flow 650P

Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film.

Thermal Materials

Bergquist's Thermal Products Group is the world leading developer and manufacturer of thermal management materials. We provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Sil-Pad products are used by many of the world's largest OEMs in various industries including automotive, computer, power supply, military and motor control.

T-Clad

Thermal Clad substrates minimize thermal impedance and conduct heat more efficiently than standard printed wiring boards (PWB's).