LB SA1800

Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer.

Liquid Dispensed Materials

Bergquist has teamed with the highly respected automated dispensing equipment companies of Scheugenpflug AG, Rampf and Graco, to further assist our customers in creating an optimized dispensing process. Like Bergquist, they are the best in the world at supplying intelligent world-class solutions. By joining in the “solutions partnership”, we amplify our capabilities as the total solution provider. Our wide portfolio of thermal products and delivery systems uniquely positions us to meet even the most challenging requirements our customers may have, helping them guarantee their long-term investment. Please contact a Bergquist representative for more information regarding automated liquid dispensing.

Gap Fillers
Bergquist Gap Filling materials deliver superior thermal conductivity and are the ideal solution for liquid dispensed applications. As form-in-place elastomers, their ultra-conforming properties provide infinite-thickness coverage for uneven board topography. They are ideal for fragile and low-stress applications such as power electronics and discrete devices:

Gap Filler 1000 (Two Part)
Thermally Conductive, Liquid Gap Filling Material
Gap Filler 1100 SF (Two Part)
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material
Gap Filler 1500 (Two-Part)
A two-part, high performance, thermally conductive liquid gap filling material
Gap Filler 2000 (Two Part)
High Thermally Conductive, Liquid Gap Filling Material
Gap Filler 3500S35 (Two Part)
High Thermally Conductive, Ultra Conforming, Liquid Gap Filling Material

Liquid Adhesive
Bergquist Liquid Adhesives allow mechanical attachment of the
component to the heat sink with thermal transfer properties without
the need for added fasteners. The Liqui-Bond product line also exhibits mild elastic properties to assist in relieving CTE mismatches. Click on the
link below for more detailed product information:

Liqui-Bond SA 1000 (One-Part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive
Liqui-Bond SA 1800 (One-Part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive
Liqui-Bond SA 2000 (One-Part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive

Thermal Interface Compounds
Bergquist's line of thermally conductive thermal interface
compounds will flow under assembly pressure to wet-out the
thermal interface surfaces and produce very low thermal
impedance. TIC products are designed for use between a
high-end computer processor and a heat sink or other high
watt density applications.

TIC 1000A
High Performance, Value Compound for High-End Computer Processors
TIC 4000
High Performance Thermal Interface Compound for Copper-Based Heat Sinks