SP900S

The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material.

Q-Pad 3

Features & Benefits Properties Configurations Product Family FAQ's

Q-Pad 3

Downloads
Selection Guide
Data Sheet
Standard Configuration (Metric)
Standard Configuration (Imperial)
RoHS Certificate

Features and Benefits

Thermal impedance: 0.35°C-in²/W (@50 psi)
Eliminates processing constraints typically associated with grease
Conforms to surface textures
Easy handling
May be installed prior to soldering and cleaning without worry

Bergquist Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Q-Pad 3 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks.

Fiberglass reinforcement enables Q-Pad 3 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

Typical Applications Include

Between a transistor and a heat sink
Between two large surfaces such as an L-bracket and the chassis of an assembly
Between a heat sink and a chassis
Under electrically isolated power modules or devices such as resistors, transformers and solid state relays