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SP900S

The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material.

Q-Pad II

Q-Pad II

Downloads
Selection Guide
Data Sheet
Standard Configuration (Metric)
Standard Configuration (Imperial)
RoHS Certificate

• Thermal impedance:
  0.22°C-in2/W (@50 psi)
• Maximum heat transfer
• Aluminum foil coated both sides
• Designed to replace thermal grease

Q-Pad II is a composite of .0015” aluminum foil coated both sides with .0025” thermally/electrically conductive Sil-Pad rubber. The material is designed for those applications where maximum heat transfer is needed and electrical isolation is not required. Q-Pad II is the ideal thermal interface material to replace messy thermal grease compounds.

Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, Q-Pad II can be used prior to these operations. Q-Pad II also eliminates dust collection which can cause possible surface shorting or heat buildup.

U.L. File Number E59150

Typical Applications Include

• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors, transformers and solid state relays