• Sil-Pad
  • Sil-Pad 400
  • Sil-Pad 800
  • Sil-Pad 900S
  • Sil-Pad 980
  • Sil-Pad 1100ST
  • Sil-Pad 1200
  • Sil-Pad A1500
  • Sil-Pad 1500ST
  • Sil-Pad 2000
  • Sil-Pad A2000
  • Sil-Pad K-4
  • Sil-Pad K-6
  • Sil-Pad K-10
  • Q-Pad II
  • Q-Pad 3
  • Poly-Pad 400
  • Poly-Pad 1000
  • Poly-Pad K-4
  • Poly-Pad K-10
  • Sil-Pad Tube
  • Sil-Pad Shield
  •  
• Gap Pad
  • Gap Pad VO
  • Gap Pad VO Soft
  • Gap Pad VO Ultra Soft
  • Gap Pad VO Ultra Soft-B
  • Gap Pad VO Ultimate
  • Gap Pad 1000SF
  • Gap Pad HC1000
  • Gap Pad 1500
  • Gap Pad 1500R
  • Gap Pad 1500S30
  • Gap Pad A2000
  • Gap Pad 2000S40
  • Gap Pad 2200SF
  • Gap Pad 2500S20
  • Gap Pad 2500
  • Gap Pad A3000
  • Gap Pad 3000S30
  • Gap Pad 5000S35
  • Gap Filler 1000
  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
• Bond-Ply
  • Bond-Ply 100
  • Bond-Ply 400
  • Bond-Ply 660P
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
• Hi-Flow Phase Change
  • Hi-Flow 105
  • Hi-Flow 225F-AC
  • Hi-Flow 225UT
  • Hi-Flow 225U
  • Hi-Flow 625
  • Hi-Flow 300P
  • Hi-Flow 300G
  • Hi-Flow 565U
  • Hi-Flow 565UT
  • Hi-Flow 650P
  • TIC 1000A
  • TIC 4000
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1000SR
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
  • TIC 1000A
  • TIC 4000
• Thermal Properties and Testing
• Awards and Certifications
• Selection Guide and Comparison Tables
• Compare Material Properties
• Part Number Builder
• LED Solutions Brochure
• Compression Deflection Contour Plots

SP900S

The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material.

Sil-Pad 800

Downloads
Selection Guide
Data Sheet
Standard Configuration (Metric)
Standard Configuration (Imperial)
RoHS Certificate

Features and Benefits

• Thermal impedance: 0.45°C-in²/W (@50 psi)
• High value material
• Smooth and highly compliant surface
• Electrically isolating

The Sil-Pad 800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.

Sil-Pad 800 material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.

Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 800 minimizes interfacial thermal resistance and maximizes thermal performance.

Typical Applications Include

• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors