Thermal Materials : Thermal Substrates : Fans and Blowers : Membrane Switches : Touch Screens

• Sil-Pad
  • Sil-Pad 400 (7 mil)
  • Sil-Pad 400 (9 mil)
  • Sil-Pad 800
  • Sil-Pad 900S
  • Sil-Pad 980
  • Sil-Pad 1100ST
  • Sil-Pad 1200
  • Sil-Pad A1500
  • Sil-Pad 1500ST
  • Sil-Pad 1750
  • Sil-Pad 2000 (10 mil)
  • Sil-Pad A2000 (15 mil)
  • Sil-Pad A2000 (20 mil)
  • Sil-Pad K-4
  • Sil-Pad K-6
  • Sil-Pad K-10
  • Q-Pad II
  • Q-Pad 3
  • Poly-Pad 1000
  • Poly-Pad K-4
  • Poly-Pad K-10
  • Sil-Pad Tube
  • Sil-Pad Shield
  •  
• Gap Pad
  • Gap Pad VO
  • Gap Pad VO Soft
  • Gap Pad VO Ultra Soft
  • Gap Pad 1000SF
  • Gap Pad 2200SF
  • Gap Pad HC1000
  • Gap Pad 1500
  • Gap Pad 1500R
  • Gap Pad 1500S30
  • Gap Pad A2000
  • Gap Pad 2000S40
  • Gap Pad 2500S20
  • Gap Pad 2500
  • Gap Pad A3000
  • Gap Pad 3000S30
  • Gap Pad 5000S35
  • Gap Filler 1000
  • Gap Filler 1100 SF
  • Gap Filler 2000
  • Gap Filler 1500
  • Gap Filler 3500S35
  •  
• Bond-Ply
  • Bond-Ply 100 (5 mil)
  • Bond-Ply 100 (8 mil)
  • Bond-Ply 100 (11 mil)
  • Bond-Ply 400
  • Bond-Ply 450
  • Bond-Ply 660B
  • Bond-Ply 660P
  • Liqui Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui Bond SA 2000
• Hi-Flow Phase Change
  • Hi-Flow 105
  • Hi-Flow 225
  • Hi-Flow 225FT
  • Hi-Flow 225UT
  • Hi-Flow 225U
  • Hi-Flow 565U
  • Hi-Flow 565UT
  • Hi-Flow 625
  • Hi-Flow 300P
  • Hi-Flow 300G
  • Hi-Flow 330P
  • TIC 1000A
  • TIC 4000
  •  
• Liquid Dispensed Materials
  • Gap Filler 1000
  • Gap Filler 1100SF
  • Gap Filler 1500
  • Gap Filler 2000
  • Gap Filler 3500S35
  • Liqui-Bond SA 1000
  • Liqui-Bond SA 1800
  • Liqui-Bond SA 2000
  • TIC 1000A
  • TIC 4000
• Thermal Properties and Testing
• Awards and Certifications
• Selection Guide and Comparison Tables
• Compare Material Properties
• Part Number Builder
• LED Solutions Brochure
• Compression Deflection Estimator

Sil-Pad 900S

• Thermal impedance: 0.61ºC-in2/W (@50 psi)
• Low mounting pressures
• Smooth and highly compliant surface
• Electrically isolating
• General-purpose thermal interface material solution

The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.

Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.

Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance.

Typical Applications Include

• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors