Question: What is the primary difference between Sil-Pad A2000 and Sil-Pad 2000 products?
Answer: Sil-Pad A2000 utilizes a different filler package than Sil-Pad 2000. This change results in a more compliant Sil-Pad A2000 material that inherently lowers interfacial resistance losses. This reduction in interfacial resistance with Sil-Pad A2000 results in improved overall thermal performance when measured at lower pressures in standard ASTM D5470 and TO-220 testing.
Question: When should I choose Sil-Pad A2000 versus Sil-Pad 2000 for my application?
Answer: The answer is based on the assumption that the primary design intent is to increase thermal performance. If your application utilizes lower clamping pressures (i.e. 10 to 75 psi) you will find the Sil-Pad A2000 to provide excellent thermal performance. In contrast, if you are designing for higher clamping pressures (i.e. 100 psi or greater), it is likely that you will require the thermal performance characteristics of the Sil-Pad 2000.
Question: Are there differences in electrical characteristics between Sil-Pad A2000 and Sil-Pad 2000?
Answer: Yes. Henkel evaluates and publishes voltage breakdown, dielectric constant, and volume resistivity data per ASTM standards for these materials. Due to differences between ASTM lab testing and actual application performance, for best results, these characteristics should be evaluated within the actual customer system.
Question: Can I get Sil-Pad A2000 in roll form?
Answer: Yes. With the new environmentally “green” process improvements added with the introduction of Sil-Pad A2000 products, the materials are now available in roll form. The original Sil-Pad 2000 material cannot be produced in continuous roll form.
Question: When should I choose Sil-Pad 800 over Sil-Pad 900S for my application?
Answer: Sil-Pad 800 is specifically formulated to provide excellent thermal performance for discrete semiconductor applications that utilize low clamping pressures (i.e. spring clips at 10 to 50 psi). In contrast, if you are designing for higher clamping pressure applications using discrete semi-conductors (i.e. 50 to 100 psi), it is likely that you will prefer the combination of high thermal performance and cut-thru resistance inherent in our Sil-Pad 900S material.
Question: When should I choose Sil-Pad 980 versus Sil-Pad 900S for my application?
Answer: Sil-Pad 980 is specifically formulated to provide superior cut-through and crush resistance in combination with excellent heat transfer and dielectric properties. Sil-Pad 980 has a proven history of reliability in high-pressure applications where surface imperfections such as burrs and dents are inherently common. These applications often include heavily machined metal surfaces manufactured from extrusions or castings. Sil-Pad 900S carries a high level of crush resistance and is more likely to be used in burr-free or controlled surface finish applications.
Question: Is there an adhesive available for the Sil-Pad 1500ST?
Answer: Sil-Pad 1500ST has an inherent tack on both sides of the material. This inherent tack is used instead of an adhesive. The tack provides sufficient adhesive for dispensing from the carrier liner and placement on the component. Sil-Pad 1500ST can be repositioned after the initial placement.
Question: How do I know which Sil-Pad is right for my specific application?
Answer: Each application has specific characteristics (e.g. surface finish, flatness tolerances, high pressure requirements, potential burrs, ect.) that determine which Sil-Pad will optimize thermal performance. Select a minimum of two pads that best fit the application, then conduct testing to determine which material performs the best.
Question: Why is the thermal performance curve of the Sil-Pad 1500ST so flat when compared to other Sil-Pads?
Answer: Sil-Pad 1500ST wets-out the applicaton surfaces at a very low pressure. Optimal thermal performance is achieved at pressure as low as 50 psi.
Question: What is ISO9001:2000?
Answer: The ISO certification is the adoption of a quality management system that is a strategic decision of the organization. This International Standard specifies requirements for a quality management system where an organization: a) needs to demonstrate its ability to consistently provide product that meets customer and applicable regulatory requirements, and b) aims to enhance customer satisfaction through the effective application if the system, including processes for continual improvement of the system and the assurance of conformity to customer and regulatory requirements.