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Sil-Pad Shield

Features and Benefits

• Bonded laminate
• Electrically isolating
• Copper shield between layers of Sil-Pad
• Pre-tinned 60/40 solder point for easy grounding

Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive insulators. Sil-Pad Shield provides:

• Shielding effectiveness of 50dB or higher  
• Good thermal transfer
• Reduced labor costs due to the elimination of having to apply thermal grease

Problem:
Radio Frequency Interference (RFI) is produced by heat sink current. The capacitance between a TO-3 encapsulated transistor and its heat sink is typically 100pf when a mica or other insulating washer is used. A power supply constructed with a standard insulator and a grounded heat sink can be expected to produce about 10 times more interference than is permitted.

Solution:
1. The use of chokes, filters and LC networks which have to be designed into the circuitry.

OR

2. Constructing a shield between the transistor and its heat sink by replacing the mica insulator with a Sil-Pad Shield (see illustration).

Typical Applications Include

• Switch mode power supplies
• EMI / RFI shield between PCB’s