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  • HPL
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LEDs - HPL

High Power Lighting Dielectric

HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements. This thin dielectric at 0.0015" (38μm) has the ability to withstand high temperatures with a glass transition of 185°C and phenomenal thermal performance of 0.30°C/W (RD 2018). Bergquist Thermal Clad HPL is available in scored array circuits, scored singulated circuit, punched singulated parts and in LED standard stars and squares configurations.

HPL Dielectric Typical Values
HPL-03015	VALUE	TEST METHOD
OPERATING VOLTAGE
Continuous AC	120 VAC	-
Continuous DC	170 VDC	-
Peak Recurring	260 VDC	-
THERMAL PROPERTIES
Thermal Conductivity	3.0 W/m-K	ASTM D5470
Thermal Resistance	0.02°Cin2/W (0.13°Ccm2/W)	ASTM D5470
Glass Transition	185°C	ASTM E1356
Max Operating Temp.	150°C*	U.L. 796
Max Soldering Temp.	325°C	U.L. 796
ELECTRICAL PROPERTIES
Dielectric Constant	6.6	ASTM D150
Dissipation Factor	0.003/0.005 (@1KHz/1MHz)	ASTM D150
Capacitance	925 pF/in2 (140pF/cm2)	ASTM D150
Volume Resistivity	10 E 14 Ω•m	ASTM D5109
Surface Resistivity	10 E 13 Ω/sq.	ASTM D5109
Dielectric Strength	2000 V/mil (75 kV/mm)	ASTM D149
Breakdown Voltage	2.5 kVAC	ASTM D149
MECHANICAL PROPERTIES
Dielectric Thickness	0.0015" (38 μm)	Visual
Peel Strength	5 lb/in (0.9 N/mm)	ASTM D2561
CTE in XY/Z Axis <Tg	35 μm/m°C	ASTM D1861
CTE in XY/Z Axis >Tg	85 μm/m°C	ASTM D1861
Storage Modulus	18/12 GPa (@25°C/150°C)	ASTM 4065
CHEMICAL PROPERTIES
Water Absorption after 168 hours	0.11% wt.	ASTM E595
Out-Gassing Total Mass Loss	0.15% wt.	ASTM E595
Collect Volatile Condensable Material	< 0.01% wt.	ASTM E595
AGENCY RATINGS & DURABILITY
U.L. Continuous Operating Temperature	150°C*	U.L. 746B
U.L. Flammability	Pending	U.L. 94
Comparative Tracking Index (CTI)	Pending	ASTM D3638
Solder Float	PASS	IPC TM 650 2.4.13
Click here to download this table as a PDF

Applications

• High watt-density applications where achieving the lowest
  thermal resistance is required
• Backlighting
• Projectors
• LED applications

Benefits

• Very low thermal impedance 0.02°Cin2/W (0.13°Ccm2/W)
• High thermal conductivity of 3.0 W/m-K
• High temperature applications
• Lead-free solder compatible
• RoHS compliant and environmentally green
• Available on all aluminum and copper metal substrates as
  well as Ultra Thin Circuits