
Bergquist introduces innovative new Thermal Clad Substrates,
supplied with pre-applied Thermal Interface Material.
Bergquist introduces the first in their innovative new line of pre-
applied thermal interface materials to T-Clad substrates. Previously,
high temperatures associated with solder reflow prevented the
application of adhesives prior to board population. T-Clad PA-
Bond-Ply 450 is a pre-applied, highly thermally conductive adhesive
tape and is the first of many new offerings to come. This material
features a release liner on the back side for easy removal and
application to heat sink. T-Clad PA substrate release liners can
withstand high temperatures and will maintain adhesion and release
characteristics even after exposure to the extreme heat of solder
reflow.
With the innovation of this new family of thermally conductive materials
comes the ability to apply electronic components to the circuit board after
the thermal interface material has been applied. This material is
punched to the exact dimensions of the board and eliminates the need
for future labor-intensive hand placement. T-Clad PA thermal interface
materials are ideal for use in motor control boards, LED boards and
rails and can attain a high bond strength to a range of surfaces including
aluminum heat sinks, many plastics and a variety of other "low
energy" surfaces.
Click Here to download the Bond-Ply 450 Data Sheet.
