• T-Clad Product Overview
• Dielectrics
  • Selection
  • Characteristics
  • Summary
  • Product Family FAQ's
• Base Metal Layer
• Optimal Design
  • Cost Effective Materials
  • Circuit Design
  • Part Fabrication
  • Design Guidelines
  • Electrical Design
  • Advanced Processes
• LEDs
  • Introduction
  • Temp. Effect
  • PCB Comparison
  • HPL
  • T-Clad PA
  • TIM Solutions
  • Standard Configurations
• Reliability Testing
• Applications
• Specialty Applications
• IsoEdge Heat Plate
• Assembly Recommendations
• Awards and Certifications
• T-Clad Selection Guide
• LED Solutions Brochure
• T-Clad Optimal Design White Paper
• Assembly Resources
  

HPL (High Power Lighting)

HPL is specifically formulated for high power lighting LED applications with demanding thermal performance requirements.

LEDs - Temperature Effects

The Effect of Temperature

The LED’s color, or wavelength, will change with temperature. As the die temperature increases, the wavelength of the color increases. This is particularly important with white light. The human eye can differentiate small color changes in white light. When Power LEDs are populated in an array, consistent thermal resistance from one die to the next assures consistent color. Because of the comparatively low thermal resistance Thermal Clad offers versus FR-4, die temperature is less affected by slight variances in the junction-to-case thermal resistance that occurs with eutectic or epoxy-die mounting techniques. It is also possible to pack the die more closely in an assembly that utilizes good thermal management techniques, thereby reducing the effects of temperature. Generally, a 30-50 percent drop in light output for a constant-forward current indicates end-of-life for Power LEDs. Power LED lifetimes have been extrapolated to over 50,000 hours.

Light output of the same LED die on different circuit board materials at a mantained die temperature of 80°C.
FR-4 110 Lumens	Thermal Clad MP 580 Lumens
Thermal Clad HT 620 Lumens	Thermal Clad HPL 630 Lumens

Thermal output of the same LED die on different circuit board materials with current maintained at manufacturer’s recommended amperage and voltage

Cost of Heat Summary

Better thermal management allows more forward current to be applied to the LED, which means more light and possibly reducing the number of LEDs required for the desired light output. Maintaining a cooler assembly at an equivalent power equates to more light per die.