Due to the size constraints and watt-density requirements in DC-DC conversion, Thermal Clad has become the favored choice. Thermal Clad offers a variety of thermal performances, is compatible with mechanical fasteners and is highly reliable. It can be used in almost every form-factor and fabricated in a wide variety of substrate metals, thicknesses and copper foil weights.
Heat-Rail and Forming
The use of Thermal Clad in heat-rail applications has grown significantly and is currently used in automotive, audio, motor control and power conversion applications. Utilizing the many advantages of surface mount assembly, attachment capabilities and high thermal performance, Thermal Clad offers a cost effective solution for heat management. When using Thermal Clad as the metal base substrate, the assembly process can be simplified and made more efficient.
In Power LED applications, light output and long life are directly attributable to how well the LED’s are managed thermally. Thermal Clad is an excellent solution for designers. Because T-Clad is a metal based material, it can be configured for special shapes, bends and thicknesses thus allowing the designer to put LED light engines in virtually any application. Mounting Power LED’s on T-Clad assures the lowest possible operating temperatures and maximum brightness, color and life.
Compact high reliability motor drives built on Thermal Clad have set the benchmark for watt-density. Dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements. With the ability to fabricate in a wide variety of form-factors, the implementation into either compact or integrated motors drives is realized. The availability of Thermal Clad HT makes high temperature operation possible.
Solid State Relays
The implementation of Solid State Relays in many control applications calls for very thermally efficient, and mechanically robust substrates. Thermal Clad offers both. The material construction allows mounting configurations not reasonably possible with ceramic substrates. New dielectrics meet the high thermal performance expectations and can even out-perform existing ceramic based designs.