T-Clad
Thermal Clad Insulated Metal Substrate was developed by Bergquist as a thermal management solution for today's higher watt-density surface mount applications where die size is reduced and heat issues are a major concern. Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard PWB's. These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications.
Power Conversion
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