• T-Clad Product Overview
• Dielectrics
  • Selection
  • Characteristics
  • Summary
  • Product Family FAQ's
• Base Metal Layer
• Optimal Design
  • Cost Effective Materials
  • Circuit Design
  • Part Fabrication
  • Design Guidelines
  • Electrical Design
  • Advanced Processes
• LEDs
  • Introduction
  • Temp. Effect
  • PCB Comparison
  • HPL
  • T-Clad PA
  • TIM Solutions
  • Standard Configurations
• Reliability Testing
• Applications
• Data Sheets
• IsoEdge Heat Plate
• Assembly Recommendations
• Awards and Certifications
• T-Clad Selection Guide
• LED Solutions Brochure
• T-Clad Optimal Design White Paper
• Assembly Resources
  

HPL (High Power Lighting)

HPL is specifically formulated for high power lighting LED applications with demanding thermal performance requirements.

Optimal Design - Cost Effective Materials

Many factors come into play in circuit design with respect to etching,
surface finishing and mechanical fabrication processes; such as
holes, flatness, singulation and tolerances.

Fabrication of Thermal Clad is similar to traditional FR-4 circuit
boards with regard to imaging and wet processing operations.
However, secondary mechanical operations are unique, so the
consideration of specific design recommendations are critical to
ensure the manufacture of reliable, cost effective T-Clad circuits.
This white paper will address design recommendations for circuit
image, soldermask, legend and mechanical fabrication. Additional
consideration for trace widths, spacing and clearances may be
required for electrical integrity based on application voltage.

Download Optimal Design White Paper (PDF)